BOSTON – Oct. 9, 2026 – PRLog — Ayar Labs said it secured another $150 million, bringing its 2026 primary capital raised to $650 million. The funding will support product development, validation, manufacturing scale-up and a new Bengaluru Design Center as AI infrastructure demand pushes suppliers to prepare co-packaged optics for volume production.
Recent moves shaping the market
- Ayar Labs — September 10: The capital will advance manufacturing readiness and product development. Wiwynn invested strategically earlier in 2026, joining backers including AMD, Intel, MediaTek and NVIDIA.
- Coherent — September 21: Coherent launched PhotonLink for co-packaged optics (CPO), near-packaged optics (NPO) and chip-to-chip connectivity. It reported more than 10 customer engagements each for CPO and NPO, expects revenue to ramp in Q4 2026, and is expanding indium phosphide and specialty-fiber capacity.
- Corning — September 17: Corning detailed a micro cable designed to increase fiber density in existing pathways, alongside multicore fiber and high-density connectors for AI data-center interconnects.
- AMD — August 25: AMD announced native UCIe 1.1 connectivity for select Versal RF Series adaptive SoCs, enabling links to specialized chiplets. Production chiplets are expected in Q4 2027.
- Sivers Semiconductors and SemiNex — August 13: The companies announced a roughly $3.4 million program for indium phosphide light sources for co-packaged optics and AI data-center links, with customer sampling and early production targeted for the second half of 2027.
These announcements show the Next-Generation Interconnect Market advancing across optical engines, fibers, light sources and standardized chiplet links. Execution will depend on component qualification, integration and manufacturing capacity keeping pace with AI infrastructure build-outs.
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